Controlling Thermal Stability and Volatility of Organogold(I) Compounds for Vapor Deposition with Complementary Ligand Design

06 May 2019, Version 2
This content is a preprint and has not undergone peer review at the time of posting.

Abstract

We compare and contrast the volatility and thermal stability of a family of twelve organometallic gold(I) compounds using a combination of X-ray crystallography, thermogravimetric analysis (TGA), and density functional theory (DFT) techniques. Pentafluorophenyl is used as a new ligand for vapor deposition which produces rather low volatility, but very thermally stable compounds when combined with PMe3 and N,N'-di-tert-butylimidazolidin-2-ylidene. We introduce a precursor figure of merit that can be used to rank precursor usefulness. Using DFT, we find a linear correlation between Au-L bond strength and thermal stability, which demonstrates the power of computational techniques to predict successful synthetic targets for future precursor design studies.

Keywords

Gold
Organometallic
Vapor deposition precursors
X-ray crystallography
Thermogravimetric analysis
Metalorganic
Atomic Layer Deposition

Supplementary materials

Title
Description
Actions
Title
Supplementary Information
Description
Actions
Title
Controlling thermal stability and volatility of organogold(I) compounds for vapour deposition with complementary ligand design v 1
Description
Actions
Title
Supplementary Information v 1
Description
Actions

Comments

Comments are not moderated before they are posted, but they can be removed by the site moderators if they are found to be in contravention of our Commenting Policy [opens in a new tab] - please read this policy before you post. Comments should be used for scholarly discussion of the content in question. You can find more information about how to use the commenting feature here [opens in a new tab] .
This site is protected by reCAPTCHA and the Google Privacy Policy [opens in a new tab] and Terms of Service [opens in a new tab] apply.