Controlling Thermal Stability and Volatility of Organogold(I) Compounds for Vapor Deposition with Complementary Ligand Design

25 April 2019, Version 1
This content is a preprint and has not undergone peer review at the time of posting.

Abstract

We compare and contrast the volatility and thermal stability of a family of twelve organometallic gold(I) compounds using a combination of X-ray crystallography, thermogravimetric analysis (TGA), and density functional theory (DFT) techniques. Pentafluorophenyl is used as a new ligand for vapor deposition which produces rather low volatility, but very thermally stable compounds when combined with PMe3 and N,N'-di-tert-butylimidazolidin-2-ylidene. We introduce a precursor figure of merit that can be used to rank precursor usefulness. Using DFT, we find a linear correlation between Au-L bond strength and thermal stability, which demonstrates the power of computational techniques to predict successful synthetic targets for future precursor design studies.

Keywords

Gold
Organometallic
Vapor deposition precursors
X-ray crystallography
Thermogravimetric analysis
Metalorganic
Atomic Layer Deposition

Supplementary materials

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