Rapid and effective method of laser metallization of dielectric materials using deep eutectic solvents with copper acetate

28 April 2023, Version 1

Abstract

In this paper, we proposed rapid laser-induced synthesis of copper micropatterns on the surface of oxide glass from deep eutectic solvents (DESs) consisting of choline chloride, citric or tartaric acid and copper acetate as copper plating solutions. It was shown that upon irradiation with continuous-wave 532-nm laser radiation, it is possible to increase the deposition rate of copper and create micropatterns with a resistance close to the value of pure metal together with high adhesion to the substrate surface. This metallization method is favorable for the practical use of copper patterns, including in production of new printable microelectronic devices. Thus, we demonstrated the possibility of copper deposition on arbitrary three-dimensional surfaces. Moreover, the resulting copper micropatterns were tested as working electrodes for non-enzymatic glucose. Finally, the proposed technology can be successfully used for design and development of sensor platforms for the electrochemical analysis and microelectronic devices

Keywords

direct laser writing
copper
sensors
deep eutectic solvents
laser processing
microelectronics

Comments

Comments are not moderated before they are posted, but they can be removed by the site moderators if they are found to be in contravention of our Commenting Policy [opens in a new tab] - please read this policy before you post. Comments should be used for scholarly discussion of the content in question. You can find more information about how to use the commenting feature here [opens in a new tab] .
This site is protected by reCAPTCHA and the Google Privacy Policy [opens in a new tab] and Terms of Service [opens in a new tab] apply.