Ether cleavage and chemical removal of SU-8

The high chemical stability of SU-8 makes it irreplaceable for a wide range of applica- tions, most notably as a lithography photoresist for micro and nanotechnology. This advantage becomes a problem when there is a need to remove SU-8 from the fabricated devices. Researchers have been struggling for two decades with this problem, and al- though a number of partial solutions have been found, this difficulty has limited the applications of SU-8. Here we demonstrate a fast, reproducible, and comparatively gen- tle method to chemically remove SU-8 photoresist. An ether cleavage mechanism for the observed reaction is proposed, and the hypothesis is tested with ab initio quantum chem- ical calculations. Also described are a polymer-metal adhesion treatment, and a comple- mentary removal method, based on atomic hydrogen inductively coupled plasma.