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Monolithic Solder-on Nanoporous Si-Cu Contacts for Stretchable Silicone Composite Sensors

submitted on 10.10.2019 and posted on 16.10.2019 by Guder Research, Estefania Nunez-Bajo, Max Grell, Yasin Cotur, Giandrin Barandun, Ji-Seon Kim, Firat Güder
We report a method of creating solderable, mechanically robust, electrical contacts to interface (soft) silicone-based strain sensors with conventional (hard) solid-state electronics using a nanoporous Si-Cu composite. The Si-based solder-on electrical contact consists of a copper-plated nanoporous Si top surface formed through metal-assisted chemical etching and electroplating, and a smooth Si bottom surface which can be covalently bonded onto silicone-based strain sensors through plasma bonding. We investigated the mechanical and electrical properties of the contacts proposed under relevant ranges of mechanical stress for applications in physiological monitoring and rehabilitation. We also produced a series of proof-of-concept devices, including a wearable respiration monitor, leg band for exercise monitoring and Squeeze-ball for monitoring rehabilitation of patients with hand injuries or neurological disorders, to demonstrate the mechanical robustness and versatility of the technology developed, in real-world applications.


EP/R010242/1 (EPSRC)

1846144 (EPSRC DTP)

EP/G037515/1 (EPSRC for Plastic Electronics Doctoral Training Centre)

EP/L016702/1 (EPSRC for Plastic Electronics Doctoral Training Centre)


Email Address of Submitting Author


Imperial College London


United Kingdom

ORCID For Submitting Author


Declaration of Conflict of Interest

The authors declare no conflict of interest.